FATSDR
Bulk Data Entry Defines the solder joint for consideration in solder fatigue analysis.
Format
(1) | (2) | (3) | (4) | (5) | (6) | (7) | (8) | (9) | (10) |
---|---|---|---|---|---|---|---|---|---|
FATSDR | ID | SDRTYP | SIDPKG | SIDPCB | |||||
DIM | PKGLEN | SDRTHK | DIAINFC | ||||||
SOLDER | SDR1 | SDR2 | etc | etc | etc |
Definitions
Field | Contents | SI Unit Example |
---|---|---|
ID | Entry identification
number. Each FATSDR entry must have a unique ID. The FATDEF Subcase Information entry may reference this ID. No default (Integer > 0) |
|
SDRTYP | Defines solder joint type.
Mandatory when the DIFFCTE method is used.
No default |
|
SIDPKG | Element SET identification
number of the component. Mandatory when the DIFFCTE method is
used. No default (Integer > 0) |
|
SIDPCB | Element SET identification
number of the PCB. Mandatory when the DIFFCTE method is used. No default (Integer > 0) |
|
DIM | Optional continuation line indicating the dimension information follows. | |
PKGLEN | Component length.
|
|
PKGTHK | Solder thickness.
|
|
DIAINFC | Joint diameter at the
interface. Since it is used as a final crack length of solder joint in DARV method, the value is mandatory when DARV method is used. No default (Real > 0) |
|
SOLDER | Continuation line indicating the solder SETs follow. | |
SDRi | Element SET of solder
"i." No default (Integer > 0) |
Comments
- For SDRTYP=XLEAD, two SDRi are expected. Otherwise, an error is issued during the run.
- Fatigue load should be a static load with Thermal Expansion Coefficient when the DIFFCTE method is used.
- Load History via the TABFAT entry is not allowed.
- If DIM continuation line is not specified, OptiStruct will attempt to measure this from Finite Element Mesh data when the DIFFCTE method is used.