# OS-E: 0895 Flat Plate with Thermal Compliance Response

Demonstrates the usage of thermal compliance responses with Topology Optimization in OptiStruct.

## Model Files

Refer to Access the Model Files to download the required model file(s).

The model file used in this example includes:

plate_therm_comp.fem

## Model Description

- Element Type
- CQUAD4, CHBDYE

**Material Properties**- Young's modulus
- 210000 Nmm
^{2} - Poisson's ratio
- 0.30
- Thermal expansion coefficient
- 1.0E-05 K
^{-1} - Thermal conductivity
- 401.0 W mm
^{-1}K^{-1} - Free convection heat transfer coefficient
- 25.0 W mm
^{-2}K^{-1}

## Optimization Formulation

- Objective
- Minimize thermal compliance (
`TCOMP`) - Constraint
- Volume fraction (
`VOLFRAC`) ≤ 0.3