Via-Trace Crosstalk
Inductive coupling is null to zero due to the perpendicular current flows on via and trace.
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PollEx DFA is an assembly status checking toolset for PCB design based on 3D package library.
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This item reports problems when low frequency power and high frequency signal traces are routed too close to each other.
This item checks whether high speed signal vias have their ground vias as shielding within a certain region.
This item checks for high speed signal’s inner via structure.
Inductive coupling is null to zero due to the perpendicular current flows on via and trace.
This item checks for a shielding ratio on design. Ground shielding should consider the effect on impedance change.
To get a stable high signal transmission, plane as return path should be on adjacent layers.
High speed signals are very sensitive for outside noise, it is better to make shielding with ground. In case of high-speed signal flows over split ground plane, the shielding effect would be reduced.
Component providers can guide their products’ signal connection specification as topology style, impedance or delay time control.
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This section contains the user guides for the following tools: DFA, DFE, DFE+, DFM, and Logic DFE.
Inductive coupling is null to zero due to the perpendicular current flows on via and trace.
Inductive coupling is null to zero due to the perpendicular current flows on via and trace.
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