Key Pad

This section examines contents related to the key pad used in mobile phone design. Because key pads are also used with a via, location of vias are important.

• Key Pad Target Component Definition
  • Target Component Selection: Select the target components with key pads from the component group list.

    
    
    Figure 1.

• Checking
  • Check Via at the Center of Inner Pad: Checks the via location in the inner pad. If it is located at the center of inner pad, it is a fail.

    
    
    Figure 2.

  • Check Via in Gap between Inner and Outer Pad: Checks whether vias are in the gap between the inner and outer pad. If it is located at the gap area, it is a fail.

    
    
    Figure 3.

  • Existence of Solder Mask: Checks the existence of solder masks and if there is no solder mask, it is a fail.

    
    
    Figure 4.

  • Silkscreen near Key Pad: If the silkscreen is overlapped with the pad, it is a fail.

    
    
    Figure 5.

  • Allowable Maximum Via Hole Size: Set the maximum size of the via hole.
  • Via Alignment: Check the via alignment, if they are not aligned, they fail.

    
    
    Figure 6.

  • Number of Vias in Inner Pad: Set the number of vias in the inner pad. If the number of inner pads is not matching with the given value, it is a fail.
  • Number of Vias in Outer Pad: Set the number of vias in the outer pad. If the number of inner pads is not matching with the given value, it is a fail.