Metal Mask

Check the metal mask design rules.

  1. Target Object Definition: Define target components.
    1. All Components: All components on design will be target components.
    2. Exclude Components: Among all components, select void-checking components from component group list.
  2. Component Group Selection: Select target components from component group list.
  3. Checking
    1. Check Co-Existence for Metal Mask and Solder Mask: For target components, check all pads have metal mask and solder mask. One of them doesn’t exist, it is fail.
      • Check matching for Metal Mask and Solder Mask: Option to check whether the size of the Metal Mask and the Solder Mask match.
      • Include DIP Component: Option to check whether the Metal Mask exists on Pad of Through Hole type component.
    2. Metal Mask Existence:
      • DIP Component Checking Condition: Option to check whether the Metal Mask exists for the Through Hole type components.
      • Component Placed Side: Option to check whether the Metal Mask exists on the pad of the component placed side.
      • Reverse Side: Option to check whether the Metal Mask exists on the pad of the opposite side.
      • Both Side: Option to check whether the Metal Mask exists on the pad of the both sides.
    3. Clearance between Metal Mask in same Component: Set the clearance value between metal masks in same components pads.
    4. Clearance between Metal Mask and Objects on certain Layers: Check the clearance between metal mask and objects placed on certain layers.
      • Layer Selection: Select layer from layer list. All objects on selected layer will be target objects.
      • Clearance: Set the clearance value between metal mask and objects on selected layer.
    5. Clearance between Metal Mask and Other Component’s Metal Mask: Set the clearance value between metal mask and metal masks in other components.


      Figure 1.
    6. Clearance between Metal Mask and Other Component’s Solder Mask: Check the clearance between metal mask and solder mask in other components.
      • Top Solder Mask Layer: Select top solder mask layer from layer list. Default is layer number three of PollEx PCB data structure.
      • Bottom Solder Mask Layer: Select bottom solder mask layer from layer list. Default is layer number 13 of PollEx PCB data structure.
      • Clearance: Set the clearance value.
    7. Clearance between Metal Mask and Via: Clearance checking between Metal Mask and Via.
      • Exclude Thermal Pad: Option to exclude the Thermal Pad from clearance checking between Metal Mask and Via. Select a component group including the thermal pad.
    8. Clearance between Metal Mask and Hole: Clearance checking between Metal Mask and Hole.