Silk Print Between Two pins

Check the existence of silkscreen between two pins of DIP type components.

In the wave-soldering process, silkscreen between two pins is necessary to prevent solder flow from one to another.
  • Target Components Definition
    • Component Group Selection: Component selection with selecting from the group list.
    • Selection by Pin Pitch: Among the selected component group, target components will be ones matching with the following conditions.


      Figure 1.
      • Condition: Select And or Or condition for the Pin Pitch option that is entered in 2) ~ 4).
      • Maximum Pin Pitch (Center to Center): Target components will be the component that has smaller pin pitches.
      • Minimum Pin Pitch (Center to Center): Target components will be the component that has larger pin pitches.
      • Maximum Distance between Pin Edges: Target components will be the component that has a smaller distance between two pin edges.
      • Minimum Distance between Pin Edges: Target components will be the component that has a larger distance between two pin edges.
  • Silkscreen Layer Definition
    • Silkscreen Layer Selection: Select the silkscreen layer from the layer list.
  • Target Layer Definition: Select the layer where the silkscreen should be placed.
    • Component Placed Layer: If the component is placed on top, silkscreen should be placed on the silkscreen top layer and vice versa is also valid.
    • Opposite Side of Component Placed Layer: If the component is placed on top, silkscreen should be placed on bottom layer and vice versa.
    • Both: Top and bottom silkscreen will be passed.
  • Option
    • Display Fail Result for All Pins. (Default: Display representative One Fail for a Component): PollEx DFM shows a representative a fail result for the component’s fail. Using this option, keep all fail occurring points in the result.


      Figure 2.